Optical Recognition Routing PCB &FPC Laser Depaneling - Automation System,CWVC-5S Advantages of Laser PCB depaneling/singulation

No mechanical stress on substrates or circuits

No tooling cost or consumables.

Versatility – ability to change applications by simply changing settings

Fiducial Recognition – more precise and clean cut

Optical Recognition before PCB depaneling/singulation process begins.

Ability to depanel virtually any substrate. (Rogers, FR4, ChemA, Teflon, ceramics, aluminum, brass, copper, etc)

Extraordinary cut quality holding tolerances as small as < 50 microns.

No design limitation – ability to cut virtually and size PCB board including complex contours and multidimensional boards

Detailed Product Description

Laser Source

Challenges of Depaneling using Routing/Die Cutting/Dicing Saws

· Damages and fractures to substrates and circuits due to mechanical stress

· Damages to PCB due to accumulated debris

· Constant need for new bits, custom dies, and blades

· Lack of versatility – each new application requires ordering of custom tools, blades, and dies

· Not good for high precision, multi-dimensional or complicated cuts

· Not useful PCB depaneling/singulation smaller boards

Lasers, on the other hand, are gaining control of the PCB depaneling/singulation market due to higher precision, lower stress on the parts, and higher throughput. Laser depaneling can be applied to a variety of applications with a simple change in settings. There is no bit or blade sharpening, lead time reordering dies and parts, or cracked/broken edges due to torque on the substrate. Application of lasers in PCB depaneling is dynamic and a non-contact process.

Specification

Cutting Application

FPC and some relative materials;

FPC/PCB/ Rigid-Flex PCB cutting, Camera module cutting.

Optical Recognition Routing PCB &FPC Laser Depaneling - Automation System,CWVC-5S CE Certification: