Video for Pcb Separator by Using Laser with CE Certification In Automotive :

Printed Circuit Board Cutting-Fpc Laser Separator System Working principle :

humidity sensor ( humidity and temperature signal ) → Microcomputer ( CPU Central Processing Unit ) → Heaters  ( PTC heating module polymer material heating ) → Smart shape memory alloy ( alloy shape with temperature change ) → Balance spring ( general balance spring with alloy )

Separator-PCB Laser Depanelizer with Flexible Pcb Laser Depaneling Features:

· Pre-camera vision product position registration and model check

· Coherent Avia NX UV laser with HurrySCAN head

· High capacity BOFA dust collector

· User friendly Window based software

· PCB flexible product jig adjustable for different board size

· High resolution and accurate Z stage with auto-focus function

· Large area low friction front loading platform for sliding multiple product jigs

· Fully covered class 1 safety enclosure

· Able to do cutting and marking together

· Compact size

Professional Customizable Fpc Laser Depaneling with CE Specification:

· No mechanical stress on substrates or circuits

· No tooling cost or consumables.

· Versatility – ability to change applications by simply changing settings

· Fiducial Recognition – more precise and clean cut

· Optical Recognition before PCB depaneling/singulation process begins.

· Ability to depanel virtually any substrate. (Rogers, FR4, ChemA, Teflon, ceramics, aluminum, brass, copper, etc)

· Extraordinary cut quality holding tolerances as small as < 50 microns.

· No design limitation – ability to cut virtually and size PCB board including complex contours and multidimensional boards