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FPC Laser Depaneling-PCB Depaneling Equipment - PCB Separators,CWVC-5L

Product description: FPC Laser Depaneling-PCB Depaneling Equipment - PCB Separators,CWVC-5L
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Laser Cut Circuit Board,Laser PCB Depaneling (Singulation) Machines,CWVC-5L Specification:

Laser	Q-Switched diode-pumped all solid-state UV laser
Laser Wavelength	355nm
Laser Power	10W/12W/15W/17W@30KHz
Positioning Precision of Worktable of Linear Motor	±2μm
Repetition Precision of Worktable of Linear Motor	±1μm
Effective Working Field	460mmX460mm(Customizable)
Laser Scanning Speed	2500mm/s (max)
Galvanometer Working Field Per One Process	40mmх40mm

PCB Depaneling by Using UV Laser,PCB Separator,CWVC-5L Features:

Pre-camera vision product position registration and model check

Coherent Avia NX UV laser with HurrySCAN head
High capacity BOFA dust collector
User friendly Window based software
PCB flexible product jig adjustable for different board size
High resolution and accurate Z stage with auto-focus function
Large area low friction front loading platform for sliding multiple product jigs
Fully covered class 1 safety enclosure
Able to do cutting and marking together

Compact size

Depaneling-Vedios of Laser PCB/PCBa Cutting by Using Laser with CE Certification Sample:

Flex Pcb Separated Machine-Cutting PCBa with Fpc Laser Depanelize,CWVC-5L Description:

PCB depaneling (singulation) laser machines and systems have been gaining popularity over recent years. Mechanical depanaling/singulation is done with routing, die cutting, and dicing saw methods. However, as the boards get smaller, thinner, flexible, and more sophisticated, those methods produce even more exaggerated mechanical stress to the parts. Large boards with heavy substrates absorb these stresses better, while these methods used on ever-shrinking and complex boards can result in breakage. This brings lower throughput, along with the added costs of tooling and waste removal associated with mechanical methods.
Increasingly, flexible circuits are found in the PCB industry, and they also present challenges to the old methods. Delicate systems reside on these boards and non-laser methods struggle to cut them without damaging the sensitive circuitry. A non-contact depaneling method is required and lasers provide a highly precise way of singulation without any risk of harming them, regardless of substrate.

CWVC-5L, China Laser PCB Separator Machine Laser Cutting with CE Certification: