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Automated Bonding System for FFC HSC FPC,CWPC-1A

Automated Bonding System for FFC HSC FPC,CWPC-1A

  • Product description: Automated Bonding System for FFC HSC FPC,CWPC-1A
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PCB Soldering Mahcine,CWPC-1A
Automated Bonding System for FFC HSC FPC,CWPC-1A Feature:
1.Extremely short cycle time with rotary table design
2.Product loading and unloading can be done during the heat sealing process
3.High quality heat seal application up to 0.25mm pitch
4.Pneumatic bonding head provide up to 3,900N force
5.Digital programmable pressure control with LCD display
6.Closed loop PID temperature control with visible LED display
7.Bonding cycle is triggered by a real time pressure sensor
8.Floating Thermode ensure consistent pressure and heat transfer along the flexfoil to LCD and/or PCB
9.Precision product fixtures (2X), easy exchange, provided with micrometer alignment and vacuum to fix components
10.Optional CCD alignment module with frame, camera, lens, monitor and illumination for fine pitch application
11.Full microprocessor logic control.

PCB Soldering Mahcine,CWPC-1A
Automated Bonding System for FFC HSC FPC,CWPC-1A Specification:
Size:                                                           620mm X 690mm X 570mm
Max. Working Area:                                   200mm X 260mm
Pneumatic Rotary Turntable Air Pressing: 0.45~0.7Mpa
Weight:                                                      95Kg


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