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Printed Circuit Board Laser PCB Depaneling Machine,CWVC-5L:
Challenges of Depaneling using Routing/Die Cutting/Dicing Saws:
· Damages and fractures to substrates and circuits due to mechanical stress
· Damages to PCB due to accumulated debris
· Constant need for new bits, custom dies, and blades
· Lack of versatility – each new application requires ordering of custom tools, blades, and dies
· Not good for high precision, multi-dimensional or complicated cuts
· Not useful PCB depaneling/singulation smaller boards
Lasers, on the other hand, are gaining control of the PCB depaneling/singulation market due to higher precision, lower stress on the parts, and higher throughput. Laser depaneling can be applied to a variety of applications with a simple change in settings. There is no bit or blade sharpening, lead time reordering dies and parts, or cracked/broken edges due to torque on the substrate. Application of lasers in PCB depaneling is dynamic and a non-contact process.
V-cut PCB Depaneling V-cut FPC Depanelizer Manufacture Specification:
Laser class |
1 |
Max. working area (X x Y x Z) |
300 mm x 300 mm x 11 mm |
Max. recognition area (X x Y) |
300 mm x 300 mm |
Max. material size (X x Y) |
350 mm x 350 mm |
Data input formats |
Gerber, X-Gerber, DXF, HPGL, |
Max. structuring speed |
Depends on application |
Positioning accuracy |
± 25 μm (1 Mil) |
Diameter of focused laser beam |
20 μm (0.8 Mil) |
Laser wavelength |
355 nm |
System dimensions (W x H x D) |
1000mm*940mm |
Weight |
~ 450 kg (990 lbs) |
Power supply |
230 VAC, 50-60 Hz, 3 kVA |
Cooling |
Air-cooled (internal water-air cooling) |
Ambient temperature |
22 °C ± 2 °C @ ± 25 μm / 22 °C ± 6 °C @ ± 50 μm |
Humidity |
< 60 % (non-condensing) |
Required accessoires |
Exhaust unit |
Working principle :
humidity sensor ( humidity and temperature signal ) → Microcomputer ( CPU Central Processing Unit ) → Heaters ( PTC heating module polymer material heating ) → Smart shape memory alloy ( alloy shape with temperature change ) → Balance spring ( general balance spring with alloy )
V-cut PCB Depaneling V-cut FPC Depanelizer Manufacture Advantages:
1.High precision CCD automatic positioning, automatic focusing. Fast and accurate positioning, save time and no worries.
2.Friendly interface,Simple operation, easy to use, free application; Small size, Save more space; rigorous security design;
3.Reduce energy consumption, Cost savings.
Cost-effective, fast cutting speed, stable performance
Laser PCB Depaneling Machine Application:
FPC and some relative materials;
FPC/PCB/ Rigid-Flex PCB cutting, Camera module cutting.
Principle of FPC Laser Cutting Machine:
Contact: Bunny
Phone: +86 136 8490 4990
Tel: 86-0769-82784046
Email: s5@smtfly.com
Add: Shenzhen, China 518103