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  • V-cut PCB Depaneling (CE) Fpc Depanelizer Manufacture,CWVC-5L
  • V-cut PCB Depaneling (CE) Fpc Depanelizer Manufacture,CWVC-5L
V-cut PCB Depaneling (CE) Fpc Depanelizer Manufacture,CWVC-5LV-cut PCB Depaneling (CE) Fpc Depanelizer Manufacture,CWVC-5L

V-cut PCB Depaneling (CE) Fpc Depanelizer Manufacture,CWVC-5L

  • Product description: V-cut PCB Depaneling Machine(CE) V-cut FPC Depanelizer Manufacture,Printed Circuit Board Laser PCB Depaneling Machine,CWVC-5L
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Printed Circuit Board Laser PCB Depaneling Machine,CWVC-5L:

Challenges of Depaneling using Routing/Die Cutting/Dicing Saws:

· Damages and fractures to substrates and circuits due to mechanical stress

· Damages to PCB due to accumulated debris

· Constant need for new bits, custom dies, and blades

· Lack of versatility – each new application requires ordering of custom tools, blades, and dies

· Not good for high precision, multi-dimensional or complicated cuts

· Not useful PCB depaneling/singulation smaller boards

Lasers, on the other hand, are gaining control of the PCB depaneling/singulation market due to higher precision, lower stress on the parts, and higher throughput. Laser depaneling can be applied to a variety of applications with a simple change in settings. There is no bit or blade sharpening, lead time reordering dies and parts, or cracked/broken edges due to torque on the substrate. Application of lasers in PCB depaneling is dynamic and a non-contact process.

V-cut PCB Depaneling V-cut FPC Depanelizer Manufacture Specification:

Laser class

1

Max. working area (X x Y x Z)

300 mm x 300 mm x 11 mm

Max. recognition area (X x Y)

300 mm x 300 mm

Max. material size (X x Y)

350 mm x 350 mm

Data input formats

Gerber, X-Gerber, DXF, HPGL,

Max. structuring speed

Depends on application

Positioning accuracy

± 25 μm (1 Mil)

Diameter of focused laser beam

20 μm (0.8 Mil)

Laser wavelength

355 nm

System dimensions (W x H x D)

1000mm*940mm
*1520 mm

Weight

~ 450 kg (990 lbs)

Power supply

230 VAC, 50-60 Hz, 3 kVA

Cooling

Air-cooled (internal water-air cooling)

Ambient temperature

22 °C ± 2 °C @ ± 25 μm / 22 °C ± 6 °C @ ± 50 μm
(71.6 °F ± 3.6 °F @ 1 Mil / 71.6 °F ± 10.8 °F @ 2 Mil)

Humidity

< 60 % (non-condensing)

Required accessoires

Exhaust unit

Working principle :

humidity sensor ( humidity and temperature signal ) → Microcomputer ( CPU Central Processing Unit ) → Heaters  ( PTC heating module polymer material heating ) → Smart shape memory alloy ( alloy shape with temperature change ) → Balance spring ( general balance spring with alloy )

V-cut PCB Depaneling V-cut FPC Depanelizer Manufacture Advantages:

1.High precision CCD automatic positioning, automatic focusing. Fast and accurate positioning, save time and no worries.

2.Friendly interface,Simple operation, easy to use, free application; Small size, Save more space; rigorous security design;

3.Reduce energy consumption, Cost savings.

Cost-effective, fast cutting speed, stable performance

Laser PCB Depaneling Machine Application:

FPC and some relative materials;

FPC/PCB/ Rigid-Flex PCB cutting, Camera module cutting.

Principle of FPC Laser Cutting Machine: