PCB Separator Equipment,Laser Cutting Machine Supplier - Inline/Offline Laser Depanel‎,CWVC-5L Features:

1. Neat and smooth edge, no burr or overflow

2. More quick and easy, shorten the delivery time;

4. High quality ,no distortion,surface clean& uniformity;

5. Gathering the CNC tech,laser tech,software tech…High accuracy,High speed

Advantages of Laser PCB depaneling/singulation:

· No mechanical stress on substrates or circuits

· No tooling cost or consumables.

· Versatility – ability to change applications by simply changing settings

· Fiducial Recognition – more precise and clean cut

· Optical Recognition before PCB depaneling/singulation process begins.

· Ability to depanel virtually any substrate. (Rogers, FR4, ChemA, Teflon, ceramics, aluminum, brass, copper, etc)

· Extraordinary cut quality holding tolerances as small as < 50 microns.

· No design limitation – ability to cut virtually and size PCB board including complex contours and multidimensional boards

humidity sensor ( humidity and temperature signal ) → Microcomputer ( CPU Central Processing Unit ) → Heaters  ( PTC heating module polymer material heating ) → Smart shape memory alloy ( alloy shape with temperature change ) → Balance spring ( general balance spring with alloy )

Application: