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  • Laser FPC Separator with Flex Pcb Depanel,CWVC-5L
Laser FPC Separator with Flex Pcb Depanel,CWVC-5L

Laser FPC Separator with Flex Pcb Depanel,CWVC-5L

  • Product description: Laser FPC Separator with Flex Pcb Depanel,CWVC-5L
Laser FPC Separator with Flex Pcb Depanel,CWVC-5L Features:
Pre-camera vision product position registration and model check
Coherent Avia NX UV laser with HurrySCAN head
High capacity BOFA dust collector
User friendly Window based software
PCB flexible product jig adjustable for different board size
High resolution and accurate Z stage with auto-focus function
Large area low friction front loading platform for sliding multiple product jigs
Fully covered class 1 safety enclosure
Able to do cutting and marking together

Compact size

Laser Pcba Separator,Pcb Cutting with UV Laser Specification:


Q-Switched diode-pumped all solid-state UV laser

Laser Wavelength


Laser Power


Positioning Precision of Worktable of Linear Motor


Repetition Precision of Worktable of Linear Motor


Effective Working Field


Laser Scanning Speed

2500mm/s (max)

Galvanometer Working Field Per One Process


A Video of Laser FPC Pcb Cutting Sample:

Laser Fpc Cutting with PCB Depanelizer Machine,CWVC-5L Description:

PCB depaneling (singulation) laser machines and systems have been gaining popularity over recent years. Mechanical depanaling/singulation is done with routing, die cutting, and dicing saw methods. However, as the boards get smaller, thinner, flexible, and more sophisticated, those methods produce even more exaggerated mechanical stress to the parts. Large boards with heavy substrates absorb these stresses better, while these methods used on ever-shrinking and complex boards can result in breakage. This brings lower throughput, along with the added costs of tooling and waste removal associated with mechanical methods.
Increasingly, flexible circuits are found in the PCB industry, and they also present challenges to the old methods. Delicate systems reside on these boards and non-laser methods struggle to cut them without damaging the sensitive circuitry. A non-contact depaneling method is required and lasers provide a highly precise way of singulation without any risk of harming them, regardless of substrate.