Pulse Heat Hot-bar Soldering & Bonding Equipment for FPC FFC HSC,CWHP-3A Features: 1. Function: used for precision HSC, FPC and LCD, PCB heat soldering applies to the 0.08mm pitch LCD modules Crimp 2. Machine architecture:aluminum alloy structure, stable deformation 3. Platform: automatic access to formula feeding mode. 4. Thermode head mechanism: four~column~tube position slide mechanism, to ensure the accuracy of crimping 5. Camera system: Optional color / monochrome camera registration system
Pulse Heat Hot-bar Soldering & Bonding Equipment for FPC FFC HSC,CWHP-3A Parameters: Heating mode: Thermostatic heating Power: 220V,1100W Max thermodeLength : 120mm Machine size: 380×450×520mm Pressure range: 20~100kgf/cm2(cylinder 50) Time control: 0.1S~999H ±0.1S Camera system: 2 groups of black and white zoom position: Temperature control: room temperature ~400±1℃ Gas source: 0.1~0.5Mpa Compressedair Net weight: 50kgs
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