• Pre-camera vision product position registration and model check
• Coherent Avia NX UV laser with HurrySCAN head
• High capacity BOFA dust collector
• User friendly Window based software
• PCB flexible product jig adjustable for different board size
• High resolution and accurate Z stage with auto-focus function
• Large area low friction front loading platform for sliding multiple product jigs
• Fully covered class 1 safety enclosure
• Able to do cutting and marking together
• Compact size

· Damages and fractures to substrates and circuits due to mechanical stress

· Damages to PCB due to accumulated debris

· Constant need for new bits, custom dies, and blades

· Lack of versatility – each new application requires ordering of custom tools, blades, and dies

· Not good for high precision, multi-dimensional or complicated cuts

· Not useful PCB depaneling/singulation smaller boards

Lasers, on the other hand, are gaining control of the PCB depaneling/singulation market due to higher precision, lower stress on the parts, and higher throughput. Laser depaneling can be applied to a variety of applications with a simple change in settings. There is no bit or blade sharpening, lead time reordering dies and parts, or cracked/broken edges due to torque on the substrate. Application of lasers in PCB depaneling is dynamic and a non-contact process.

FPC Depaneling,China FPC Depaneling Manufacturers sample:

Professional PCB and FPC Separator-Printed Circuit Board Processing with UV Lasers,CWVC-5L CE Certification: