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  • Separator Auto Machine for Pcb Aluminum Board and FPC,CWVC-5L
Separator Auto Machine for Pcb Aluminum Board and FPC,CWVC-5L

Separator Auto Machine for Pcb Aluminum Board and FPC,CWVC-5L

  • Product description: Separator Auto Machine for Pcb Aluminum Board and FPC,CWVC-5L

Separator Auto Machine for Pcb Aluminum Board and FPC,CWVC-5L Specification:

Laser class


Max. working area (X x Y x Z)

300 mm x 300 mm x 11 mm

Max. recognition area (X x Y)

300 mm x 300 mm

Max. material size (X x Y)

350 mm x 350 mm

Data input formats

Gerber, X-Gerber, DXF, HPGL,

Max. structuring speed

Depends on application

Positioning accuracy

± 25 μm (1 Mil)

Diameter of focused laser beam

20 μm (0.8 Mil)

Laser wavelength

355 nm

System dimensions (W x H x D)

*1520 mm


~ 450 kg (990 lbs)

Power supply

230 VAC, 50-60 Hz, 3 kVA


Air-cooled (internal water-air cooling)

Ambient temperature

22 °C ± 2 °C @ ± 25 μm / 22 °C ± 6 °C @ ± 50 μm
(71.6 °F ± 3.6 °F @ 1 Mil / 71.6 °F ± 10.8 °F @ 2 Mil)


< 60 % (non-condensing)

Required accessoires

Exhaust unit

Flexiable Printed Circuit Depanelizer Machine Working principle :

humidity sensor ( humidity and temperature signal ) → Microcomputer ( CPU Central Processing Unit ) → Heaters  ( PTC heating module polymer material heating ) → Smart shape memory alloy ( alloy shape with temperature change ) → Balance spring ( general balance spring with alloy )


PCB depaneling (singulation) laser machines and systems have been gaining popularity over recent years. Mechanical depanaling/singulation is done with routing, die cutting, and dicing saw methods. However, as the boards get smaller, thinner, flexible, and more sophisticated, those methods produce even more exaggerated mechanical stress to the parts. Large boards with heavy substrates absorb these stresses better, while these methods used on ever-shrinking and complex boards can result in breakage. This brings lower throughput, along with the added costs of tooling and waste removal associated with mechanical methods.

Increasingly, flexible circuits are found in the PCB industry, and they also present challenges to the old methods. Delicate systems reside on these boards and non-laser methods struggle to cut them without damaging the sensitive circuitry. A non-contact depaneling method is required and lasers provide a highly precise way of singulation without any risk of harming them, regardless of substrate.

Separator Auto Machine For Pcb Aluminum Board and FPC Features:

  1. Neat and smooth edge, no burr or overflow;
  2. More quick and easy, shorten the delivery time;
  3. More quick and easy, shorten the delivery time
  4. High quality ,no distortion,surface clean& uniformity;
  5. Gathering the CNC tech,laser tech,software tech…High accuracy,High speed;
  6. Pre-camera vision product position registration and model check;
  7. Coherent Avia NX UV laser with HurrySCAN head;
  8. High capacity BOFA dust collecto;
  9. User friendly Window based software;
  10. PCB flexible product jig adjustable for different board size;
  11. High resolution and accurate Z stage with auto-focus function;
  12. Large area low friction front loading platform for sliding multiple product jigs;
  13. Fully covered class 1 safety enclosure;
  14. Able to do cutting and marking together;
  15. Compact size.

Advantages of Laser PCB depaneling/singulation

No mechanical stress on substrates or circuits

No tooling cost or consumables.

Versatility ability to change applications by simply changing settings

Fiducial Recognition more precise and clean cut

Optical Recognition before PCB depaneling/singulation process begins.

Ability to depanel virtually any substrate. (Rogers, FR4, ChemA, Teflon, ceramics, aluminum, brass, copper, etc)

Extraordinary cut quality holding tolerances as small as < 50 microns.

No design limitation ability to cut virtually and size PCB board including complex contours and multidimensional boards

Detailed Product Description

Product Name:

Laser Pcb Separator


Low Power Consumption.



Laser Brand:



220V 380v


1 Year

Challenges of Depaneling using Routing/Die Cutting/Dicing Saws

· Damages and fractures to substrates and circuits due to mechanical stress

· Damages to PCB due to accumulated debris

· Constant need for new bits, custom dies, and blades

· Lack of versatility – each new application requires ordering of custom tools, blades, and dies

· Not good for high precision, multi-dimensional or complicated cuts

· Not useful PCB depaneling/singulation smaller boards

Lasers, on the other hand, are gaining control of the PCB depaneling/singulation market due to higher precision, lower stress on the parts, and higher throughput. Laser depaneling can be applied to a variety of applications with a simple change in settings. There is no bit or blade sharpening, lead time reordering dies and parts, or cracked/broken edges due to torque on the substrate. Application of lasers in PCB depaneling is dynamic and a non-contact process.


1.High precision CCD automatic positioning, automatic focusing. Fast and accurate positioning, save time and no worries.

2.Friendly interface,Simple operation, easy to use, free application; Small size, Save more space; rigorous security design;

3.Reduce energy consumption, Cost savings.

Cost-effective, fast cutting speed, stable performance

Laser PCB Depaneling Machine Application:

FPC and some relative materials;

FPC/PCB/ Rigid-Flex PCB cutting, Camera module cutting;

Principle of PCB Laser Cutting Machine: