Home > Laser Depanel Machine

  • UV Laser System for PCB Separator,Cut PCB,PCB PCB Shear Cutter,CWVC-5L
  • UV Laser System for PCB Separator,Cut PCB,PCB PCB Shear Cutter,CWVC-5L
UV Laser System for PCB Separator,Cut PCB,PCB PCB Shear Cutter,CWVC-5LUV Laser System for PCB Separator,Cut PCB,PCB PCB Shear Cutter,CWVC-5L

UV Laser System for PCB Separator,Cut PCB,PCB PCB Shear Cutter,CWVC-5L

  • Product description: UV Laser System for PCB Separator,Cut PCB,PCB PCB Shear Cutter,CWVC-5L
  • INQUIRY

Pcb Depaneling without Stress,UV Laser System for Flex Pcb Cutting,CWVC-5L Features:

  1. Neat and smooth edge, no burr or overflow;
  2. More quick and easy, shorten the delivery time;
  3. More quick and easy, shorten the delivery time;
  4. High quality ,no distortion,surface clean& uniformity;
  5. Gathering the CNC tech,laser tech,software tech…High accuracy,High speed;
  6. Pre-camera vision product position registration and model check;
  7. Coherent Avia NX UV laser with HurrySCAN head;
  8. High capacity BOFA dust collecto;
  9. User friendly Window based software;
  10. PCB flexible product jig adjustable for different board size;
  11. High resolution and accurate Z stage with auto-focus function;
  12. Large area low friction front loading platform for sliding multiple product jigs;
  13. Fully covered class 1 safety enclosure;
  14. Able to do cutting and marking together;
  15. Compact size.

Advantages:

1.High precision CCD automatic positioning, automatic focusing. Fast and accurate positioning, save time and no worries.

2.Friendly interface,Simple operation, easy to use, free application; Small size, Save more space; rigorous security design;

3.Reduce energy consumption, Cost savings.

Cost-effective, fast cutting speed, stable performance

UV Laser System for PCB Separator,Cut PCB,PCB PCB Shear Cutter,CWVC-5L Specification:

Laser class

1

Max. working area (X x Y x Z)

300 mm x 300 mm x 11 mm

Max. recognition area (X x Y)

300 mm x 300 mm

Max. material size (X x Y)

350 mm x 350 mm

Data input formats

Gerber, X-Gerber, DXF, HPGL,

Max. structuring speed

Depends on application

Positioning accuracy

± 25 μm (1 Mil)

Diameter of focused laser beam

20 μm (0.8 Mil)

Laser wavelength

355 nm

System dimensions (W x H x D)

1000mm*940mm
*1520 mm

Weight

~ 450 kg (990 lbs)

Power supply

230 VAC, 50-60 Hz, 3 kVA

Cooling

Air-cooled (internal water-air cooling)

Ambient temperature

22 °C ± 2 °C @ ± 25 μm / 22 °C ± 6 °C @ ± 50 μm
(71.6 °F ± 3.6 °F @ 1 Mil / 71.6 °F ± 10.8 °F @ 2 Mil)

Humidity

< 60 % (non-condensing)

Required accessoires

Exhaust unit

Working principle :

humidity sensor ( humidity and temperature signal ) → Microcomputer ( CPU Central Processing Unit ) → Heaters  ( PTC heating module polymer material heating ) → Smart shape memory alloy ( alloy shape with temperature change ) → Balance spring ( general balance spring with alloy )

Laser PCB Depaneling Machine Application:

FPC and some relative materials;

FPC/PCB/ Rigid-Flex PCB cutting, Camera module cutting;

Customer Visit Our Machine Pictures: