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Glue Dispensing Device of Chip Assembling Machine,CWDJ-D1

Product description: Glue Dispensing Device of Chip Assembling Machine,CWDJ-D1
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Glue Dispensing Device of Chip Assembling Machine,CWDJ-D1 Parameter:

Working stroke:	X/Y/Z 300mm300mm100mm (free setting)
Top speed:	1000mm/sec
Repeat ability accuracy:	±0.05mm
Control system:	Professional dispensing machine hand held control system
Program storage:	100 groups
Storage space:	2G
Turn the mode:	Japan micro stepping motor + Taiwan + silver belt guide
Maximum load:	X/Y/Z 10KG/10KG/5KG
Running speed:	Max 10 m / Sec
Power supply:	AC220V 50 - 60HZ 1.2KW
Weight:	50Kg
Machine size:	500500600mm

SMT Glue Dispenser Robot Dispensing Black Glue on PCB SMD IC Characteristic：

1.with painting points, lines, arcs, circles, irregular curves, continuous feeding, input procedures and other functions and three-dimensional dispensing;

2.arbitrary point, line, surface, arc and other irregular curve continuous dispensing function.

3.high speed, low noise, step motor in Japan makes dispensing better.

4.Electrostatic eliminator can eliminate static electricity within + 100V

5.automatic dispensing compensation function, so that more convenient operation.

6.XY regional array, translation, rotation, computing function, anti material disk, suitable for different positions.

7.the scope of application: semiconductor package, PCB plate fixing and protection, LCD glass packaging and stickers, mobile phone board dispensing, key products, packaging and dispensing, dispensing speaker battery box dispensing, auto parts, hardware parts, packaging glue glue liquid quantitative filling, chip bonding etc..

8.to adapt to the glue: UV glue, AB glue, glue, glue, black EMI conductive adhesive, epoxy resin, instant glue, silver glue, red glue, paste, paste, solder paste, transparent paint, plastic screw etc..

Desktop Automated Dispensing Machines Used PCB / FPC Soldering: