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Laser PCB Machine / Inline PCB De-panel Depaneling Solutions

Laser PCB Machine / Inline PCB De-panel Depaneling Solutions

  • Product description: Laser PCB Machine / Inline PCB De-panel Depaneling Solutions
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17W UV Laser PCB Machine / Inline PCB De-panel Depaneling Solutions CWVC-5L Specification:

Laser Q-Switched diode-pumped all solid-state UV laser
Laser Wavelength 355nm
Laser Power 10W/12W/15W/17W@30KHz
Positioning Precision of Worktable of Linear Motor ±2μm
Repetition Precision of Worktable of Linear Motor ±1μm
Effective Working Field 460mmX460mm(Customizable)
Laser Scanning Speed 2500mm/s (max)
Galvanometer Working Field Per One Process 40mmх40mm

Inline Laser Pcb Depaneling Machine Description:

PCB depaneling (singulation) laser machines and systems have been gaining popularity over recent years. Mechanical depanaling/singulation is done with routing, die cutting, and dicing saw methods. However, as the boards get smaller, thinner, flexible, and more sophisticated, those methods produce even more exaggerated mechanical stress to the parts. Large boards with heavy substrates absorb these stresses better, while these methods used on ever-shrinking and complex boards can result in breakage. This brings lower throughput, along with the added costs of tooling and waste removal associated with mechanical methods.

Increasingly, flexible circuits are found in the PCB industry, and they also present challenges to the old methods. Delicate systems reside on these boards and non-laser methods struggle to cut them without damaging the sensitive circuitry. A non-contact depaneling method is required and lasers provide a highly precise way of singulation without any risk of harming them, regardless of substrate.

PCB UV Laser Separator Machine-Laser PCB Depaneling Machine Features:

  1. More quick and easy, shorten the delivery time;
  2. High quality no distortion surface clean& uniformity;
  3. Gathering the CNC tech laser tech software tech…High accuracy High speed.

Advantages of Laser PCB depaneling/singulation:

  • No mechanical stress on substrates or circuits
  • No tooling cost or consumables.
  • Versatility – ability to change applications by simply changing settings
  • Fiducial Recognition – more precise and clean cut
  • Optical Recognition before PCB depaneling/singulation process begins.
  • Ability to depanel virtually any substrate. (Rogers, FR4, ChemA, Teflon, ceramics, aluminum, brass, copper, etc)
  • Extraordinary cut quality holding tolerances as small as < 50 microns.
  • No design limitation – ability to cut virtually and size PCB board including complex contours and multidimensional boards